Intel · 2012
Intel BD82QS77
The Intel BD82QS77 is a mobile chipset for LGA 1155 Ivy Bridge processors, released in 2012.
The Intel BD82QS77 is a mobile chipset designed for Intel Ivy Bridge processors with LGA 1155 socket. Manufactured on a 65 nm process, it has a TDP of only 3.0 W, making it suitable for low-power systems. It supports up to 8 GB of DDR3 memory at 800/1066 MHz across two channels, without ECC support. The chipset provides 8 PCIe 2.0 lanes and uses DMI 2.0 for CPU communication. Storage connectivity includes 4 SATA III ports and 8 USB 2.0 ports, but no USB 3.2 Gen 1 or Thunderbolt. Integrated Ethernet supports 10/100/1000 speeds. It supports Intel Rapid Start Technology and Smart Connect Technology, but lacks Intel Rapid Storage Technology, vPro, and overclocking features. The chipset is compatible with UCFF (4" x 4") form factors.
Specifications
| Socket unverified | LGA 1155 |
|---|---|
| Platform unverified | Mobile |
| Process node unverified | 65 nm |
| TDP unverified | 3.0 W |
| PCIe version unverified | 2.0 |
| Total PCIe lanes (chipset) unverified | 8 |
| DMI version unverified | 2.0 |
| Memory support unverified | DDR3 800/1066 |
| Max memory unverified | 8 GB |
| Memory channels unverified | 2 |
| ECC memory support unverified | No |
| SATA III ports unverified | 4 |
| USB 3.2 Gen 1 ports unverified | 0 |
| USB 2.0 ports unverified | 8 |
| Thunderbolt support unverified | No |
| Integrated Ethernet | 10/100/1000 |
| Integrated Wi-Fi | No |
| Integrated Bluetooth | No |
| Intel Rapid Storage Technology | No |
| vPro support unverified | No |
| CPU overclocking unverified | No |
| Memory overclocking (XMP/EXPO) unverified | No |
| Supported form factors | UCFF (4" x 4") |
| Release date unverified | 2012-04-08 |
| Release year unverified | 2012 |
| Notes unverified | The QS77 is a mobile chipset for Ivy Bridge processors. It supports Intel Rapid Start Technology and Smart Connect Technology. |