News from manufacturers

Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors

Intel is leveraging advanced packaging technology to combine multiple specialized chips into a single powerful unit, addressing the increasing computational demands of AI. The company's approach interconnects chips to function together, aiming to handle massive workloads more efficiently.

Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave

Intel Foundry has completed the RAMP-C program, which was launched in September 2021. The program supported the development of domestic leading-edge CMOS technology and manufacturing in the United States, laying the groundwork for expanded trusted domestic semiconductor production.

“Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.” — Intel

Apple Upgrade launches in the United States

Apple has launched a hardware leasing program called Apple Upgrade in the United States. It is available through the Apple Store online, the Apple Store app, and at physical Apple Store locations.

Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era

Intel and Lens Technology have announced a strategic collaboration to develop glass substrate-based packaging solutions. The partnership aims to advance semiconductor packaging technology for AI applications by improving performance and interconnect density.

Intel Reports Second-Quarter 2026 Financial Results

Intel published its second-quarter 2026 financial results, making the earnings release and presentation available on its Investor Relations website. The company also scheduled an earnings conference call for investors.

AAI 2026: AMD Delivers Full-Stack Compute for the Agentic AI Era

No press release excerpt provided.

AMD and Cerebras Announce Industry-Leading Ultra-Low-Latency and High Throughput AI Inference Solution

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From tokens to tasks: Why agentic AI changes the infrastructure conversation

The press release argues that agentic AI, which involves multi-step workflows rather than single prompt-response interactions, shifts performance metrics from token throughput to task completion. It emphasizes that the CPU plays a critical role in orchestrating the surrounding infrastructure—such as parsing, tool calls, sandboxing, and verification—beyond just model execution.

Celebrating 10 years of conservation and technology collaboration between WILDLABS and Arm

In 2015, Arm and United for Wildlife launched WILDLABS to connect conservationists and technologists. The network now includes over 16,000 members from more than 180 countries. Arm provides funding, technical expertise, and supports initiatives like the Women in Conservation Technology program.

Apple Maps to power navigation experience for Ford UEV Platform

Apple and Ford have announced that Apple Maps will be integrated into Ford's UEV Platform using the MapKit for Automotive SDK. This integration will provide navigation features for Ford vehicles.