Intel · 2018
Intel FH82CM246
The Intel FH82CM246 is a mobile chipset for LGA 1151 sockets, released in 2018 on a 14 nm process with 3 W TDP.
The Intel FH82CM246 is a mobile chipset designed for LGA 1151 sockets, released in April 2018. It is built on a 14 nm process with a TDP of 3 W. The chipset supports DDR4-2666 memory up to 64 GB across two channels, including ECC memory. It provides 24 PCIe 3.0 lanes, 8 SATA III ports, and multiple USB ports: 6 USB 3.2 Gen 2, 10 USB 3.2 Gen 1, and 14 USB 2.0. It features integrated Ethernet and Intel Wireless-AC MAC, but no Thunderbolt or Bluetooth. It supports Intel Rapid Storage Technology, vPro, and memory overclocking (XMP/EXPO), but not CPU overclocking. The FH82CM246 is used with mobile processors and succeeded the CM236, later replaced by the WM590.
Specifications
| Socket unverified | LGA 1151 |
|---|---|
| Platform | Mobile |
| Process node unverified | 14 nm |
| TDP | 3 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 24 |
| DMI version | 3.0 |
| Memory support unverified | DDR4-2666 |
| Max memory unverified | 64 GB |
| Memory channels | 2 |
| ECC memory support | Yes |
| SATA III ports | 8 |
| USB4 ports | 0 |
| USB 3.2 Gen 2x2 ports | 0 |
| USB 3.2 Gen 2 ports | 6 |
| USB 3.2 Gen 1 ports | 10 |
| USB 2.0 ports | 14 |
| Thunderbolt support unverified | No |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wireless-AC MAC |
| Integrated Bluetooth unverified | No |
| Intel Rapid Storage Technology | Yes |
| vPro support | Yes |
| CPU overclocking unverified | No |
| Memory overclocking (XMP/EXPO) | Yes |
| Supported form factors unverified | BGA |
| Release date | 2018-04 |
| Release year | 2018 |
| Launch MSRP | 51 USD |
| Successor unverified | WM590 |
| Predecessor unverified | CM236 |