Intel · 2017
Intel GL82CM238
The Intel GL82CM238 is a mobile chipset released in 2017, featuring a 22 nm process node and 3.67 W TDP.
The Intel GL82CM238 is a mobile chipset introduced in 2017, built on a 22 nm process with a TDP of 3.67 W. It supports DDR4 memory up to 64 GB across two channels and includes ECC memory support. The chipset provides 20 PCIe 3.0 lanes, 8 SATA III ports, 10 USB 3.2 Gen 1 ports, and 14 USB 2.0 ports. It features integrated Ethernet MAC, Intel Wireless-AC, and Bluetooth 4.2. The GL82CM238 supports Intel Rapid Storage Technology, Intel Optane Memory, and vPro. It uses a BGA 1440 socket and is designed for mobile platforms. The chipset does not support Thunderbolt, CPU overclocking, or USB 3.2 Gen 2x2/Gen 2 ports.
Specifications
| Socket unverified | BGA 1440 |
|---|---|
| Platform | Mobile |
| Process node | 22 nm |
| TDP | 3.67 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 20 |
| DMI version | 3.0 |
| Memory support unverified | DDR4 |
| Max memory unverified | 64 GB |
| Memory channels | 2 |
| ECC memory support | Yes |
| SATA III ports | 8 |
| USB 3.2 Gen 2x2 ports unverified | 0 |
| USB 3.2 Gen 2 ports unverified | 0 |
| USB 3.2 Gen 1 ports | 10 |
| USB 2.0 ports | 14 |
| Thunderbolt support unverified | No |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi unverified | Intel Wireless-AC |
| Integrated Bluetooth unverified | Bluetooth 4.2 |
| Intel Rapid Storage Technology | Yes |
| vPro support | Yes |
| CPU overclocking unverified | No |
| Memory overclocking (XMP/EXPO) | Yes |
| Supported form factors unverified | BGA |
| Release date unverified | 2017-01-03 |
| Release year | 2017 |
| Launch MSRP | 50 USD |
| Notes | Embedded options available; supports Intel Optane Memory; Industrial Commercial Temp |