Intel · 2017
Intel GL82HM175
The Intel GL82HM175 is a mobile chipset released in 2017 for 7th Gen Intel Core processors, featuring a 22 nm process and 2.6 W TDP.
The Intel GL82HM175 is a mobile chipset designed for 7th Gen Intel Core processors, launched in 2017. It uses a 22 nm process node and has a TDP of 2.6 W. The chipset supports LGA 1150 socket and provides 16 PCIe 3.0 lanes, DMI 3.0 interface, and up to 64 GB of DDR3L or DDR4 memory across two channels. It does not support ECC memory. Storage connectivity includes 4 SATA III ports, and USB support comprises 8 USB 3.2 Gen 1 ports and 14 USB 2.0 ports. The chipset features an integrated MAC for Ethernet but lacks integrated Wi-Fi, Bluetooth, and Thunderbolt. It supports Intel Rapid Storage Technology, CPU overclocking, and memory overclocking (XMP/EXPO). vPro is not supported. The GL82HM175 is intended for mobile platforms and was released with a launch MSRP of $48.00.
Specifications
| Socket unverified | LGA 1150 |
|---|---|
| Platform | Mobile |
| Process node | 22 nm |
| TDP | 2.6 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 16 |
| DMI version | 3.0 |
| Memory support | DDR3L, DDR4 |
| Max memory | 64 GB |
| Memory channels | 2 |
| ECC memory support | No |
| SATA III ports | 4 |
| USB 3.2 Gen 2x2 ports | 0 |
| USB 3.2 Gen 2 ports | 0 |
| USB 3.2 Gen 1 ports | 8 |
| USB 2.0 ports | 14 |
| Thunderbolt support | No |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | No |
| Integrated Bluetooth | No |
| Intel Rapid Storage Technology | Yes |
| vPro support | No |
| CPU overclocking | Yes |
| Memory overclocking (XMP/EXPO) | Yes |
| Supported form factors | Mobile |
| Release date | 2017-01-01 |
| Release year | 2017 |
| Launch MSRP | 48.00 USD |
| Notes | Mobile chipset for 7th Gen Intel Core processors |