Intel · 2022
Intel HM670
The Intel HM670 is a mobile chipset for BGA 1744 sockets, released in 2022. It supports DDR4/DDR5 memory, PCIe 4.0/3.0, and Thunderbolt 4.
The Intel HM670 is a mobile chipset designed for BGA 1744 sockets, released in April 2022 with a launch MSRP of $54. It has a TDP of 3.7 W and supports DDR4 and DDR5 memory up to 64 GB across two channels, without ECC support. The chipset provides 28 PCIe lanes (version 4.0 and 3.0) and a DMI 4.0 interface. It includes 8 SATA III ports, 4 USB 3.2 Gen 2x2 ports, 10 USB 3.2 Gen 2 ports, 10 USB 3.2 Gen 1 ports, and 14 USB 2.0 ports. Thunderbolt 4 is supported, but no USB4 ports. Integrated Ethernet MAC and Intel Wi-Fi 6E AX211 are included. Features Intel Rapid Storage Technology, CPU overclocking, and memory overclocking (XMP/EXPO).
Specifications
| Socket unverified | BGA 1744 |
|---|---|
| Platform | Mobile |
| TDP | 3.7 W |
| PCIe version | 4.0, 3.0 |
| Total PCIe lanes (chipset) | 28 |
| DMI version | 4.0 |
| Memory support unverified | DDR4, DDR5 |
| Max memory unverified | 64 GB |
| Memory channels | 2 |
| ECC memory support | No |
| SATA III ports | 8 |
| USB4 ports unverified | 0 |
| USB 3.2 Gen 2x2 ports | 4 |
| USB 3.2 Gen 2 ports | 10 |
| USB 3.2 Gen 1 ports | 10 |
| USB 2.0 ports | 14 |
| Thunderbolt support unverified | 4 |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wi-Fi 6E AX211 |
| Intel Rapid Storage Technology | Yes |
| CPU overclocking | Yes |
| Memory overclocking (XMP/EXPO) | Yes |
| Release date | 2022-04-01 |
| Release year | 2022 |
| Launch MSRP | 54 USD |