AMD · 2017
A300
The A300 (AMD) is a chipset released in 2017, part of AMD's AM4 platform, with extremely low power consumption and no integrated I/O features.
The A300 (AMD) is a chipset introduced in February 2017 as part of AMD's AM4 platform. It is based on the Knoll Express architecture and has a minimal power draw of approximately 120 microwatts (0.00012 W TDP). The chipset lacks all standard I/O interfaces, including PCIe lanes, USB ports (2.0, 3.2 Gen 1, 3.2 Gen 2), SATA III ports, and memory support. It does not support ECC memory, CPU overclocking, or memory overclocking (XMP/EXPO). The A300 is designed for basic systems where the processor provides all connectivity, such as with AMD Ryzen CPUs that have integrated graphics and direct CPU-attached storage and USB.
Specifications
| TDP unverified | 0.00012 W |
|---|---|
| PCIe version unverified | None |
| Total PCIe lanes (chipset) unverified | 0 |
| Memory support unverified | None |
| Max memory unverified | 0 GB |
| Memory channels unverified | 0 |
| ECC memory support unverified | No |
| SATA III ports unverified | 0 |
| USB4 ports unverified | 0 |
| USB 3.2 Gen 2x2 ports unverified | 0 |
| USB 3.2 Gen 2 ports unverified | 0 |
| USB 3.2 Gen 1 ports unverified | 0 |
| USB 2.0 ports unverified | 0 |
| Thunderbolt support unverified | None |
| Integrated Ethernet unverified | None |
| Integrated Wi-Fi unverified | None |
| Integrated Bluetooth unverified | None |
| Intel Rapid Storage Technology unverified | No |
| vPro support unverified | No |
| CPU overclocking unverified | No |
| Memory overclocking (XMP/EXPO) unverified | No |
| Release date unverified | 2017-02 |
| Release year unverified | 2017 |
| Notes unverified | Knoll Express architecture; ~120 μW TDP; no PCIe, USB, SATA, or storage features; ECC not supported; no overclocking. |