Intel · 2022
Intel 82371MX
The Intel 82371MX is a mobile chipset released in Q1 2022, built on a 7 nm process with a 9 W TDP.
The Intel 82371MX is a mobile chipset released in Q1 2022. It is built on a 7 nm process and has a thermal design power (TDP) of 9 W. The chipset supports up to 64 GB of memory across two channels, with options for LPDDR5 at 5200 MT/s or LPDDR4x at 4267 MT/s. It does not support ECC memory. The chipset provides 14 PCIe Gen 4 lanes and includes Intel Thunderbolt 4 support. It is designed for mobile platforms and uses the FCBGA1781 socket.
Specifications
| Socket | FCBGA1781 |
|---|---|
| Platform | Mobile |
| Process node | 7 nm |
| TDP | 9 W |
| PCIe version | Gen 4 |
| Total PCIe lanes (chipset) | 14 |
| Memory support | Up to LPDDR5 5200 MT/s Up to LPDDR4x 4267 MT/s |
| Max memory | 64 GB |
| Memory channels | 2 |
| ECC memory support | No |
| Thunderbolt support | Intel® Thunderbolt™ 4 |
| Release date | 2022-Q1 |
| Release year | 2022 |