Intel · 2020
Intel BD82HM70
The Intel BD82HM70 is a mobile chipset released in 2020 with a 3 W TDP, supporting DMI 3.0 and PCIe 3.0.
The Intel BD82HM70 is a mobile chipset designed for laptops and notebooks, released on April 1, 2020. It features a thermal design power (TDP) of just 3 W, making it suitable for power-efficient systems. The chipset provides 16 PCIe 3.0 lanes, four SATA III ports, and a range of USB connectivity including four USB 3.2 Gen 2, eight USB 3.2 Gen 1, and fourteen USB 2.0 ports. It integrates an Intel Wi-Fi 6 AX201 module and an integrated MAC for Ethernet. The BD82HM70 supports Intel Rapid Storage Technology, memory overclocking (XMP/EXPO), and CPU overclocking, but does not support ECC memory. It uses DMI 3.0 for communication with the processor.
Specifications
| Platform | Mobile |
|---|---|
| TDP | 3 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 16 |
| DMI version | 3.0 |
| ECC memory support | No |
| SATA III ports | 4 |
| USB 3.2 Gen 2 ports | 4 |
| USB 3.2 Gen 1 ports | 8 |
| USB 2.0 ports | 14 |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wi-Fi 6 AX201 |
| Intel Rapid Storage Technology | Yes |
| CPU overclocking | Yes |
| Memory overclocking (XMP/EXPO) | Yes |
| Release date | 2020-04-01 |
| Release year | 2020 |