Intel · 2018
Intel FH82HM370
The Intel FH82HM370 is a mobile chipset for LGA 1151 rev 2 sockets, released in 2018.
The Intel FH82HM370 is a mobile chipset introduced in April 2018 with a launch MSRP of $49. It supports LGA 1151 rev 2 sockets and has a TDP of 3 W. The chipset provides 16 PCIe 3.0 lanes and uses DMI 3.0 for connection to the CPU. It supports up to 64 GB of DDR4 memory across two channels, without ECC support. Storage includes 4 SATA III ports, and connectivity offers 4 USB 3.2 Gen 2, 8 USB 3.2 Gen 1, and 14 USB 2.0 ports. It features an integrated MAC for Ethernet and Intel Wireless-AC MAC for Wi-Fi. Intel Rapid Storage Technology is supported, and both CPU and memory overclocking (XMP/EXPO) are enabled. The chipset is designed for mobile platforms and comes in a 25mm x 24mm package.
Specifications
| Socket unverified | LGA 1151 rev 2 |
|---|---|
| Platform | Mobile |
| TDP | 3 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 16 |
| DMI version | 3.0 |
| Memory support | DDR4 |
| Max memory | 64 GB |
| Memory channels | 2 |
| ECC memory support | No |
| SATA III ports | 4 |
| USB 3.2 Gen 2 ports | 4 |
| USB 3.2 Gen 1 ports | 8 |
| USB 2.0 ports | 14 |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wireless-AC MAC |
| Intel Rapid Storage Technology | Yes |
| CPU overclocking | Yes |
| Memory overclocking (XMP/EXPO) | Yes |
| Release date | 2018-04-01 |
| Release year | 2018 |
| Launch MSRP | 49 USD |
| Notes | Package size: 25mm x 24mm |