Intel · 2018
Intel FH82QM370
The Intel FH82QM370 is a mobile chipset for LGA 1151 rev 2, released in 2018 with a TDP of 3 W.
The Intel FH82QM370 is a mobile platform chipset introduced in April 2018. It supports LGA 1151 rev 2 sockets and DDR4 memory without ECC. The chipset provides 20 PCIe 3.0 lanes, 4 SATA III ports, and multiple USB ports including 6 USB 3.2 Gen 2, 10 USB 3.2 Gen 1, and 14 USB 2.0. It features an integrated MAC for Ethernet and Intel Wireless-AC MAC for Wi-Fi. Additional capabilities include Intel Rapid Storage Technology, vPro support, and memory overclocking (XMP/EXPO). The chipset has a TDP of 3 W and was priced at $49.00 MSRP.
Specifications
| Socket unverified | LGA 1151 rev 2 |
|---|---|
| Platform | Mobile |
| TDP | 3 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 20 |
| DMI version | 3.0 |
| Memory support unverified | DDR4 |
| ECC memory support | No |
| SATA III ports | 4 |
| USB 3.2 Gen 2 ports | 6 |
| USB 3.2 Gen 1 ports | 10 |
| USB 2.0 ports | 14 |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wireless-AC MAC |
| Intel Rapid Storage Technology | Yes |
| vPro support | Yes |
| Memory overclocking (XMP/EXPO) | Yes |
| Release date | 2018-04-01 |
| Release year | 2018 |
| Launch MSRP | 49.00 USD |