Intel · 2022
Intel H670
The Intel H670 is a desktop chipset for LGA 1700 sockets, released in 2022 with a TDP of 6 W and support for PCIe 4.0 and 3.0.
The Intel H670 is a desktop chipset released in 2022 for LGA 1700 sockets. It has a TDP of 6 W and supports PCIe 4.0 and 3.0, with 24 total chipset PCIe lanes. It features DMI 4.0, eight SATA III ports, and integrated Ethernet MAC. It also includes integrated Intel Wi-Fi 6E AX211 and Intel Rapid Storage Technology. The chipset supports memory overclocking via XMP/EXPO but does not support CPU overclocking or ECC memory. It provides two USB 3.2 Gen 2x2 ports, four USB 3.2 Gen 2 ports, eight USB 3.2 Gen 1 ports, and fourteen USB 2.0 ports. The H670 is designed for use with Intel 12th and 13th generation processors.
Specifications
| Socket unverified | LGA 1700 |
|---|---|
| Platform | Desktop |
| TDP | 6 W |
| PCIe version | 3.0, 4.0 |
| Total PCIe lanes (chipset) | 24 |
| DMI version | 4.0 |
| ECC memory support | No |
| SATA III ports | 8 |
| USB4 ports | 0 |
| USB 3.2 Gen 2x2 ports | 2 |
| USB 3.2 Gen 2 ports | 4 |
| USB 3.2 Gen 1 ports | 8 |
| USB 2.0 ports | 14 |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wi-Fi 6E AX211 |
| Intel Rapid Storage Technology | Yes |
| CPU overclocking | No |
| Memory overclocking (XMP/EXPO) | Yes |
| Release date | 2022-01-01 |
| Release year | 2022 |
| Launch MSRP | 36 USD |