Intel · 2017
Intel HM175
The Intel HM175 is a mobile chipset released in 2017, designed for BGA 1440 socket processors.
The Intel HM175 is a mobile chipset introduced in January 2017, built on a 22 nm process with a TDP of 2.6 W. It supports DDR4-2400 memory up to 64 GB across two channels, but does not support ECC memory. The chipset provides 16 PCIe 3.0 lanes, 4 SATA III ports, 8 USB 3.2 Gen 1 ports, and 14 USB 2.0 ports. It features an integrated MAC for Ethernet, Intel Rapid Storage Technology, and supports CPU and memory overclocking (XMP). The HM175 is intended for use with Intel mobile processors in the BGA 1440 package.
Specifications
| Socket unverified | BGA 1440 |
|---|---|
| Platform | Mobile |
| Process node | 22 nm |
| TDP | 2.6 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 16 |
| DMI version | 3.0 |
| Memory support unverified | DDR4-2400 |
| Max memory unverified | 64 GB |
| Memory channels | 2 |
| ECC memory support | No |
| SATA III ports | 4 |
| USB 3.2 Gen 1 ports | 8 |
| USB 2.0 ports | 14 |
| Integrated Ethernet | Integrated MAC |
| Intel Rapid Storage Technology | Yes |
| CPU overclocking | Yes |
| Memory overclocking (XMP/EXPO) | Yes |
| Release date unverified | 2017-01-03 |
| Release year | 2017 |
| Launch MSRP | 48 USD |