Intel · 2018
Intel HM370
The Intel HM370 is a mobile chipset released in 2018, designed for Intel processors with BGA 1440 socket.
The Intel HM370 is a mobile chipset released in 2018, featuring a TDP of 3 W. It supports DDR4 memory with up to 64 GB across two channels, but does not support ECC memory. The chipset provides 16 PCIe 3.0 lanes, 4 SATA III ports, and multiple USB ports: 4 USB 3.2 Gen 2, 8 USB 3.2 Gen 1, and 14 USB 2.0. It includes Thunderbolt 3 support, integrated Ethernet MAC, and integrated Intel Wireless-AC MAC. Intel Rapid Storage Technology is supported, as well as CPU and memory overclocking (XMP/EXPO). The HM370 is used with compatible Intel mobile processors and has a launch MSRP of $49.
Specifications
| Socket unverified | BGA 1440 |
|---|---|
| Platform | Mobile |
| TDP | 3 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 16 |
| DMI version | 3.0 |
| Memory support unverified | DDR4 |
| Max memory unverified | 64 GB |
| Memory channels | 2 |
| ECC memory support | No |
| SATA III ports | 4 |
| USB 3.2 Gen 2 ports | 4 |
| USB 3.2 Gen 1 ports | 8 |
| USB 2.0 ports | 14 |
| Thunderbolt support unverified | 3 |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wireless-AC MAC |
| Intel Rapid Storage Technology | Yes |
| CPU overclocking | Yes |
| Memory overclocking (XMP/EXPO) | Yes |
| Release date | 2018-04-01 |
| Release year | 2018 |
| Launch MSRP | 49 USD |