Intel · 2022
Intel Q670
The Intel Q670 is a chipset for Alder Lake processors, released in 2022 for LGA 1700 sockets.
The Intel Q670 is a chipset designed for Intel's Alder Lake platform, using the LGA 1700 socket. It was released in January 2022 with a launch MSRP of $52. The chipset has a TDP of 6 W and measures 28mm x 25mm. It supports PCIe 4.0 and 3.0, with a total of 24 chipset lanes and a DMI 4.0 interface. Memory support includes dual-channel DDR4/DDR5 without ECC and no memory overclocking (XMP/EXPO). Storage options include 8 SATA III ports, and connectivity features 4 USB 3.2 Gen 2x2, 8 USB 3.2 Gen 2, 10 USB 3.2 Gen 1, and 14 USB 2.0 ports. Integrated Ethernet MAC and Intel Wi-Fi 6E AX211 are included. The Q670 supports Intel Rapid Storage Technology and vPro, making it suitable for business and enterprise systems. It is paired with Alder Lake processors and can be used in motherboards with LGA 1700 sockets.
Specifications
| Socket unverified | LGA 1700 |
|---|---|
| Platform unverified | Alder Lake |
| TDP | 6 W |
| PCIe version | 4.0, 3.0 |
| Total PCIe lanes (chipset) | 24 |
| DMI version | 4.0 |
| Memory channels | 2 |
| ECC memory support | No |
| SATA III ports | 8 |
| USB 3.2 Gen 2x2 ports | 4 |
| USB 3.2 Gen 2 ports | 8 |
| USB 3.2 Gen 1 ports | 10 |
| USB 2.0 ports | 14 |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wi-Fi 6E AX211 |
| Intel Rapid Storage Technology | Yes |
| vPro support | Yes |
| Memory overclocking (XMP/EXPO) | No |
| Release date | 2022-01-01 |
| Release year | 2022 |
| Launch MSRP | 52 USD |
| Notes | Chipset Base Power: 6 W; Package Size: 28mm x 25mm |