Intel · 2018
Intel QM370
The Intel QM370 is a mobile chipset for Coffee Lake processors, released in 2018 with a 14 nm process and 3 W TDP.
The Intel QM370 is a mobile chipset designed for Coffee Lake processors, released in April 2018. It uses a 14 nm process node and has a TDP of 3 W. The chipset supports DDR4-2666 memory with up to 64 GB across two channels, but does not support ECC memory. It provides 20 PCIe 3.0 lanes and uses DMI 3.0 for connection to the CPU. Storage connectivity includes 4 SATA III ports. USB support includes 6 USB 3.2 Gen 2 ports, 10 USB 3.2 Gen 1 ports, and 14 USB 2.0 ports, with no USB 3.2 Gen 2x2. Thunderbolt 3 is supported. The chipset integrates an Ethernet MAC and Intel Wireless-AC MAC. It features Intel Rapid Storage Technology and vPro support, but does not support CPU or memory overclocking. The launch MSRP was $49.
Specifications
| Socket unverified | BGA 1440 |
|---|---|
| Platform unverified | Coffee Lake |
| Process node unverified | 14 nm |
| TDP | 3 W |
| PCIe version | 3.0 |
| Total PCIe lanes (chipset) | 20 |
| DMI version | 3.0 |
| Memory support unverified | DDR4-2666 |
| Max memory unverified | 64 GB |
| Memory channels | 2 |
| ECC memory support | No |
| SATA III ports | 4 |
| USB 3.2 Gen 2x2 ports | 0 |
| USB 3.2 Gen 2 ports | 6 |
| USB 3.2 Gen 1 ports | 10 |
| USB 2.0 ports | 14 |
| Thunderbolt support unverified | 3 |
| Integrated Ethernet | Integrated MAC |
| Integrated Wi-Fi | Intel Wireless-AC MAC |
| Intel Rapid Storage Technology | Yes |
| vPro support | Yes |
| CPU overclocking | No |
| Memory overclocking (XMP/EXPO) | No |
| Release date | 2018-04-01 |
| Release year | 2018 |
| Launch MSRP | 49 USD |