AMD · 2019
X570
The X570 is a chipset for AMD AM4 motherboards, released in July 2019. It supports PCIe 4.0 and CPU overclocking.
The X570 is a chipset designed by AMD for the AM4 platform, released in July 2019. It is built on a 14 nm process with a TDP of 15 W. The chipset provides 16 PCIe 4.0 lanes, enabling high-speed connectivity for graphics cards and NVMe SSDs. It supports DDR4 memory with ECC capability and offers extensive I/O: 12 SATA III ports, 8 USB 3.2 Gen 2 ports, and 4 USB 2.0 ports. The X570 is used with AMD Ryzen processors (Matisse/Vermeer) and is notable for being a repurposed IO die from those CPUs. It allows CPU overclocking and is compatible with AM4 socket motherboards.
Specifications
| Socket unverified | AM4 |
|---|---|
| Platform unverified | AM4 |
| Process node unverified | 14 nm |
| TDP unverified | 15 W |
| PCIe version unverified | 4.0 |
| Total PCIe lanes (chipset) unverified | 16 |
| Memory support unverified | DDR4 |
| ECC memory support unverified | Yes |
| SATA III ports unverified | 12 |
| USB 3.2 Gen 2 ports unverified | 8 |
| USB 3.2 Gen 1 ports unverified | 0 |
| USB 2.0 ports unverified | 4 |
| CPU overclocking unverified | Yes |
| Release date unverified | 2019-07 |
| Release year unverified | 2019 |
| Notes unverified | Chipset designed by AMD, codenamed Bixby. Repurposed Matisse/Vermeer IO die. |